Method and apparatus for packaging hot melt adhesives using molds and carriers

Patent Name: Method and Apparatus for Packaging Hot-Melt Adhesives Using Molds and Carriers Patent Applicant Bostkfinli Corporation Principal Applicant Address Wisconsin Inventor Mark D. Alpert; Atul May Hertha Application (Patent) No. 200380109956.5 Date of Application 2003.12.17 Certification Date Approval Notice No. 1753814 Date of Auditing Approval 2006.03.29 Instruction CD No. D0613-1 Main Classification No. B65B63/08 (2006.01) I Classification No. B65B63/08 (2006.01) I Division Original Application No. 2002.12.24 US 10/329,191 Abstract is a binary mold assembly for packaging hot melt adhesives, wherein the mold (3) is preferably an open disk shape, which includes lined with plastic The cavity of the film (8). The mold (3) has a hole (7) in communication with the cavity to promote the vacuum formation of the film (8) on the inner surface of the cavity. The second element is the carrier of the mold (3), which is also preferably an open disk shape (10). The carrier also includes a cavity for accommodating the mold (3), the function of which is not only to support the mold (3) nested therein, but also to quickly and effectively remove, disperse, or absorb the melt in the mold (3) as a heat sink. The heat of the adhesive. After the mold (3) is filled with a large amount of adhesive, the exposed open upper surface of the adhesive is covered with a second plastic film (18), and then the film (18) is lined with the mold ( 3) The inner first film (8) is sealed. After cooling, the packaged adhesive is cut along the seal into individual adhesive pieces for subsequent processing. Slaves 1. A method of packaging a hot melt adhesive, comprising the steps of: providing a mold having a cavity having an exposed open top; adding a thin film liner of a thermoplastic material to the cavity The lining mold is placed in a carrier to provide a binary mold assembly; the binary mold assembly is placed in a cooling medium; and the first cavity is filled with a desired amount of molten hot melt adhesive An agent, wherein the adhesive mass has an exposed surface; and cooling the adhesive to a desired temperature. International Application 2003-12-17 PCT/US2003/040297 International Publication 2004-07-15 WO2004/058575 English