712 plastic formula

formula

Component dosage /g component dosage /g
E-51 Epoxy Resin 100 Curing Agent Polyamide 94
D-17 Epoxy Resin 28.5 Aluminum Oxide (250-300 mesh) 20
600# epoxy thinner 10

Preparation and curing Weigh in order and mix well. Under 80 curing 1h or 150 curing 1h.

Application The adhesive is used for bonding of aluminum alloy parts, with good toughness and high strength.

Source: 21st Century Fine Chemicals Network

Epoxy modified phenolic resin adhesive formula

formula

Component dosage /g component dosage /g
E-42 epoxy resin 40 ammonia phenolic resin 60

Prepare and cure the following 60 glues, degassing at 80, (8.5-8.7) x 104 Pa for 80 min after gluing; then cure at 0.5 MPa pressure, 110 °C for 1 h, then cure at 110-180 °C for 1 h, 180 °C Curing for 10h.

Use The temperature for the use of the adhesive is room temperature 150, high viscosity, high temperature resistance, good heat aging resistance, can be used to bond aluminum, aluminum alloys and other metals.

Source: 21st Century Fine Chemicals Network